A low solids-content slurry for polishing (e.g., chemical mechanical
planarization) of substrates comprising a dielectric and an associated
method using the slurry are described. The slurry and associated method
afford high removal rates of dielectric during polishing even though the
slurry has low solids-content. The slurry comprises a bicarbonate salt,
which acts as a catalyst for increasing removal rates of dielectric films
during polishing of these substrates.