Apparatus and method are provided for facilitating cooling of an
electronics rack employing an air delivery structure coupled to the
electronics rack. The air delivery structure delivers air flow at a
location external to the electronics rack and in a direction to
facilitate mixing thereof with re-circulating exhausted inlet-to-outlet
air flow from the air outlet side of the electronics rack to the air
inlet side thereof. The delivered air flow is cooler than the
re-circulating exhausted inlet-to-outlet air flow and when mixed with the
re-circulating air flow facilitates lowering air inlet temperature at a
portion of the air inlet side of the electronics rack, thereby enhancing
cooling of the electronics rack.