A method of forming a composite overlay compound on a substrate includes
forming a mixture including at least one component from a first group of
component materials including titanium, chrome, tungsten, vanadium,
niobium, and molybdenum. The mixture also includes at least one component
from a second group of component materials including carbon and boron,
and the mixture further includes at least one component from a third
group of component materials including silicon, nickel, and manganese.
The mixture of selected component materials is then applied to a
substrate material to form an overlay compound on the substrate material.
The overlay compound is fused to the substrate to form a metallurgical
bond between the substrate material and the overlay compound.