The polyimides of the present invention are derived from aliphatic
diamines and show advantageous arc tracking performance (i.e., low arc
tracking). These polyimides can be cured at low temperatures making them
suitable as coverlay compositions in electronic circuitry. In addition,
these polyimides are soluble and excellent in heat resistance and
adhesion properties, showing a low dielectric constant even at 10 GHz or
more.