Methods are provided for semiconductor devices having low contact
resistance. The method in accordance with one embodiment of the invention
comprises forming an insulating layer overlying a semiconductor
substrate, the semiconductor substrate having a device region therein. An
opening is formed through the insulating layer to expose a portion of the
device region, and the portion of the device region is then electrically
contacted by a metallic liner layer. To reduce the resistance of the
liner layer and hence the contact, ions of a conductivity determining
impurity are implanted into the metallic liner layer. A metal layer is
then deposited overlying the metallic liner layer to fill the opening
through the insulating layer and to form a conductive plug.