An electrical splice assembly includes a bus plate having a plurality of coplanar, spaced male blades extending from the bus plate in cantilever fashion, a plurality of female terminals attached to the male blades, and a generally U-shaped housing of extrudable shape. The housing has an elongate open end portion defining a terminal receiving cavity, a closed end portion and an intermediate portion defining a slot that communicates with the terminal receiving cavity. The bus plate is at least partially disposed in the slot and the spaced male blades are at least partially disposed in the terminal receiving cavity along with the female terminals attached to them. The bus plate is a sheet metal stamping and the housing is an extrusion. The female terminals are attached to selected ones of the male blades to form a sub-assembly that is inserted laterally into the housing so the bus plate is at least partially disposed in the slot and the female terminals are disposed in the terminal receiving cavity. During manufacture a bus plate of appropriate length may be severed from a long sheet metal bus plate precursor and a housing of appropriate length may be severed from a long extruded housing precursor.