A radio frequency integrated circuit (RFIC) includes a die and a package. The die includes a radio frequency (RF) input/output (I/O) section, an RF to baseband conversion section, and a baseband processing section. The package includes a ball grid array and an antenna. The antenna is located on one edge of the package and the solder balls of the ball grid array proximal to the antenna are used to couple the RF I/O section of the die to the antenna.