The present invention relates to a method of polishing an implantable
medical device. The method may include positioning an implantable medical
device on a support. At least a portion of a surface of the implantable
medical device may include a polymer. A fluid may be contacted with at
least a portion of the surface of the positioned implantable medical
device. In an embodiment, the fluid may be capable of dissolving at least
a portion of the polymer at or near the surface of the implantable
medical device. The method may further include allowing the fluid to
modify at least a portion of the surface of the positioned medical
device. A majority of the contacted fluid may be removed from the surface
of the implantable medical device. In certain embodiments, the modified
portion of the surface may be substantially less thrombogenetic and
substantially more mechanically stable than an unmodified surface.