Methods and apparatus are provided for removing plating from a device. The method and apparatus may be used for preparing an electrical connector for connecting at least one wire or other terminus thereto where the electrical connector has at least one electrical contact with a metal coating thereon. The method includes the steps of applying molten solder to the electrical contact whereby the coating dissolves into the molten solder to thereby create a molten coating-solder mixture and rotating the electrical connector whereby the molten coating-solder mixture is removed from the electrical contact.