According to one embodiment, a first recording film, interlayer, and second recording film are formed on a transparent resin substrate having a groove and land. A recording mark is formed by irradiation with a short-wavelength laser beam. The light reflectance of the recording mark formed by irradiation with the short-wavelength laser beam is higher than a light reflectance before irradiation with the short-wavelength laser beam. The first recording film has a first read-only recording mark recorded by a three-dimensional pit. The second recording film has a second read-only recording mark recorded by a three-dimensional pit. The reflectances of the pits of the first and second recording layers are 4.2% to 8.4%, or the pit width of the second recording film is larger than that of the first recording layer.