The invention provides a method for forming a uniform conductive-film interconnecting pattern via simplified processes. In particular, the invention provides: a method for forming an interconnecting pattern having at least one corner and which does not cause irregularities at the corner, an interconnecting pattern formed according to the method, and an electronic apparatus and a non-contact type card medium including the interconnecting pattern. The method includes forming a line pattern having at least one corner defined by at least two lines by applying a liquid containing a pattern material to a substrate. The liquid is applied by ink jet printing such that the corner has at least one additional protrusion other than the two lines, and is then fired to transform into a conductive-film interconnecting pattern.