Various systems and methods for implementing multi-mode semiconductor
devices are discussed herein. For example, a multi-mode semiconductor
device is disclosed that includes a device package with a number of
package pins. In addition, the device includes a semiconductor die with
at least two IO buffers. One of the IO buffers is located a distance from
a particular package pin and another of the IO buffers is located a
greater distance from the particular package pin. The IO buffer located
closest to the package pin includes first bond pad electrically coupled
to a circuit implementing a first interface type and a first floating
bond pad, and the other IO buffer includes a second bond pad electrically
coupled to a circuit implementing a second interface type and a second
floating bond pad. In some cases, the first floating bond pad is
electrically coupled to the circuit implementing the second interface
type via a metal layer wire, and the first floating bond pad is
electrically coupled to the particular package pin.