A polishing method usable in an apparatus including a rotatable member
rotatable about a first axis, at least one substrate head assembly
supported on said rotatable member, and at least two polishing surfaces
arranged below said rotatable member at respective angular positions
about said first axis is described. In one implementation, a substrate
can be mounted onto a first one of said at least one substrate head
assembly. The rotatable member can be rotated to a position so that the
substrate overlies a selected one of the polishing surfaces. The
substrate can be engaged with said selected polishing surface and
relative linear movement imparted between the selected polishing surface
and the first substrate head assembly, while the substrate is engaged
with the selected polishing surface.