A thermoplastic molding composition comprising a linear (co)polyformal is
disclosed. The (co)polyformal corresponds to formulae (Ia) or (Ib),
##STR00001## in which A independently denotes hydrogen or phenyl,
--O-D-O-- and --O-E-O-- independently denote a diphenolate residue, in
which -E- and -D- independently denote an aromatic radical having 6 to 40
C atoms, wherein at least one of --O-D-O-- and --O-E-O-- denotes
1,1-bis(4-hydroxyphenyl)cyclohexane residue. The composition is
characterized in its restricted water absorption. Also disclosed is a
process for the preparation of the composition.