An automotive center stack panel assembly is provided comprising an instrument panel face plate having an outer face plate surface and an internal face plate surface. A display window region is formed into the instrument panel face plate and has a curved internal window surface. A flat flex circuit assembly is in direct contact with the curved internal window surface. The flat flex circuit assembly includes a plurality of field effect sensors. A clamp plate backer is mounted to the internal face plate surface. A soft durometer backer is positioned between the clamp plate backer and the flat flex circuit assembly. The clamp plate backer compresses the soft durometer backer such that the soft durometer backer presses the field effect sensors into direct contact with the curved internal window surface without adhesives.