The invention enhances reliability and achieves higher speeds for
semiconductor devices with a stacked structure. A semiconductor device
includes a die pad, a plurality of semiconductor chips stacked on one
surface of the die pad, leads extending toward the die pad, first wires
that are bonded to first pads of a first semiconductor chip among the
plurality of semiconductor chips and to second pads of a second
semiconductor chip among the plurality of semiconductor chips, second
wires that are bonded to the leads and to the first pads or the second
pads, and a sealing material that seals the plurality of semiconductor
chips and exposes another surface of the die pad.