The present invention represents a significant advancement in the field of thermal solutions for computer hardware. In one embodiment, a quick-connect system for cooling a heat-generating electronic device is provided. The electronic device is mounted to a first side of a circuit board. The system includes a first plate having an opening and configured to be coupled to the first side of the circuit board. The system further includes a second plate disposed within the opening and coupled to the first plate with a first suspension system, wherein the first suspension system is configured to enable the second plate to be disposed substantially flat against the electronic device when the first plate is coupled to the first side of the circuit board. The system further includes a cooling module thermally coupled to the second plate and configured to dissipate heat transferred from the electronic device to the second plate.