A CPU cooling assembly having a first, covering layer of conductive material above the upper surface of an enclosed, heat producing chip and a third, upper layer of conductive material (a heat sink base plate) thermally bonded to the first by an intermediate, second layer of thin, conforming material (thermal grease) that is far less thermally conductive, and more resistive, than the other two layers. The relative thickness relationship of the first and third, more conductive, layers is essentially reversed from the prior art, with first layer being relatively thicker than the third. This creates an overall lower resistance for the three layer sandwich.