A system is designed to facilitate heat transfer via radiation, convection and conduction from components within the system to the external environment and housing. The system includes a thermally conductive plate positioned between a surface of the housing and one or more heat generating components within the housing. A compliant thermally conductive material may then be placed between the heat generating components and the plate to facilitate conductive heat transfer from the component to the plate. From the plate, heat is transferred to the external environment through radiation and convection of air through perforations in the housing which cover a substantial portion of the surface area of the housing. The housing may also be inexpensively manufactured through stamping and may include two mating pieces which interlock using chamfered electrostatic discharge fingers. The housing may also incorporate a metal shroud for enveloping certain ESD sensitive connectors, such as optical couplers.