A photoresist composition includes a novolac resin having where each of R.sub.1, R.sub.2, R.sub.3, and R.sub.4 is an alkyl group having a hydrogen atom or between one through six carbon atoms and n is an integer ranging from zero through three; and a mercapto compound having Z.sub.1-SH, or SH-Z.sub.2-SH, where each of Z.sub.1 and Z.sub.2 is an alkyl group or an allyl group having one through twenty carbon atoms, a sensitizer, and a solvent.

 
Web www.patentalert.com

< Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the same

< Compressible flexographic printing plate construction

> Photosensitive resin composition for optical waveguides, and optical waveguide and manufacturing method thereof

> Resist composition and patterning process

~ 00284