A method and system for designing a probe card from data provided by
prospective customers via the Internet is provided. Design specifications
are entered into the system by prospective customers and compiled into a
database. The collective feasibility of each set of design specifications
is determined by an automated computer system and communicated to the
prospective customer. If feasible, additional software enables
prospective customers to create verification packages according to their
respective design specifications. These verification packages further
consist of drawing files visually describing the final design and
verification files confirming wafer bonding pad data. Verification
packages are reviewed and forwarded to an applications engineer after
customer approval. An interactive simulation of probe card performance is
also provided. Data on probe card performance is incorporated into an
overall modeling exercise, which includes not only the probe card, but
data on the device(s) under test and wafer, as well as data on automated
test equipment.