An extensible data analysis system for analyzing integrated circuit fabrication data produced during integrated circuit fabrication, including an application tier that selectively runs analysis nodes. The application tier has an architecture for optionally including and excluding a desired selection of the analysis nodes. The application tier architecture allows the selection of the analysis nodes to be dynamically added by a user. A data access tier selectively runs data reader nodes. The data access tier has an architecture for optionally including and excluding a desired selection of the data reader nodes. The data reader nodes interpret a desired variety of data source files containing the integrated circuit fabrication data having different formats for access by the application tier. The data access tier architecture allows the selection of the data reader nodes to be dynamically added by the user.