A chip-on-chip-structure semiconductor device for a radio communication device, having a base band chip and a high-frequency chip piled up on and bonded to the surface thereof. The base band chip has a low-frequency signal processing unit for processing a signal in a first frequency band. The high-frequency chip has a high-frequency signal processing unit for processing a signal in a second frequency band of which frequency is higher than that of the first frequency band.

 
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< Method of selecting maximum transmission power level to be used by a radio telecommunications base station or base stations in a network, a radio telecommunications base station and radio telecommunications network

< Wireless communications system, wireless microphone transmission apparatus, and wireless receiving apparatus

> System and method for battery conservation with assistance from the network and radio resource management

> Radio-based intelligent terminal and program for notice of gateway exchange
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