The photosensitive polymer includes a first monomer which is norbornene ester having C.sub.1 to C.sub.12 aliphatic alcohol as a substituent, and a second monomer which is maleic anhydride. A chemically amplified photoresist composition, containing the photosensitive polymer, has an improved etching resistance and adhesion to underlying layer materials, and exhibits wettability to developing solutions.

 
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