A heat sink having graduated lengths of fins, with the tallest fins being
in the center of the heat sink to provide maximum heat removal from a
mated integrated circuit (IC) chip. Dual fans impinge air against the
fins, and particularly the tallest fins, to provide a highly efficient
system for heat removal from the IC chip. By reducing the size of the
lateral fins, additional space is made available for the dual fans. The
use of the dual fans allows the fans to run at a lower speed that a
single fan, thus reducing an overall fan acoustic level. Furthermore, the
dual fans allow for a backup fan system if one of the fans should fail.