The metal wirings of the uppermost layer are exposed so as to be contactable to the probe and arranged so as to be spatially separated from one another via spaces that are approximately parallel to the longitudinal direction of the dicing area, and the position and size of the space is designed considering a thickness of a cutting edge of a blade and relative positioning error, and the blade does not cross any metal wirings when the blade passes through the dicing area, thereby preventing the generation of an abruption or a burr due to the dicing to enhance a yield in IC production.

 
Web www.patentalert.com

< Method for fabricating a semiconductor device having a heat radiation layer including forming scribe lines and dicing

< Partial wafer bonding and dicing

> Semiconductor device and method for producing the same by dicing

> Method for dicing semiconductor chips and corresponding semiconductor chip system

~ 00277