A low-profile, insert molded contact block and corresponding printed circuit board assembly are provided for coupling electronic circuitry disposed on printed wiring boards to external electronic devices. The contact block includes a plurality of L-shaped, metal contacts insert molded into a housing. The housing includes bracing members that circumscribe the metal contacts so that at least a portion of the front and rear faces of the metal contacts are exposed between the bracing members. The contact block may be coupled to a printed wiring board in an automated, reflow solder process utilizing automated pick and place equipment. The contact block is placed on the printed wiring board such that the metal contacts are seated on conductive pads with solder paste disposed thereon. The resulting assembly may then be heated in a reflow oven to permanently affix the metal contacts to the conductive pads. The contact block, which can be on the order of 0.6 millimeters thick, can significantly reduce the overall size of the host electronic device.