An arrangement of pads with selective via in pad for mounting a semiconductor package on a substrate. In order to strengthen the soldered bonds, standard pads, which have a stronger bond, are used in locations of greatest stress and deflection. Vias in pad (VIP) are used at all other locations to improve routing advantages due to their smaller surface area.

 
Web www.patentalert.com

< Semiconductor device including an electrical contact connected to an interconnection

< Capacitor and method of producing same

> Semiconductor device, stacked semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

> Components, methods and assemblies for multi-chip packages

~ 00270