A heat and impact resistant adhesive is disclosed. The adhesive can include at least one acrylic-based monomer, at least epoxy based monomer/resin, at least one bifunctional monomer chemically reactive with the acrylic-based monomer and the epoxy based monomer/resin, at least one impact modifier, and a catalyst system.

 
Web www.patentalert.com

< Apparatus for processing semiconductor devices in a singulated form

< Heat-settable resins

> Ultraviolet activatable adhesive film

> Halogen-free resin composition

~ 00267