A resin-encapsulated semiconductor device includes a semiconductor chip, a plurality
of inner leads that are connected to a group of electrodes of the semiconductor
chip, respectively, and an encapsulating resin that encapsulates a connection part
located between the semiconductor chip and the inner leads. Each of the inner leads
includes a protruded portion provided on a surface thereof on an outer side relative
to the periphery of the semiconductor chip. The protruded portion protrudes in
a thickness direction and is provided with a step portion formed in its side portion.
The group of electrodes of the semiconductor chip is connected to surfaces of inner
portions of the inner leads located on an inner side relative to their protruded
portions, through electroconductive bumps, respectively. The encapsulating resin
encapsulates the semiconductor chip and the electroconductive bumps and is formed
to expose surfaces of the protruded portions. The surfaces of the protruded portions
that function as external terminals can be reduced in size and thereby the pitch
between the external terminals can be reduced.