The present invention is directed to reducing the build up or accretion of adhesive, alone or in combination with other materials, on the surfaces of equipment used to ultrasonically treat a workpiece (e.g., ultrasonically bonding various components or pieces to one another.) Thus the invention encompasses composites, absorbent products, and methods of making said composites and products where an adhesive composition having certain identified properties is used to reduce the build up or accretion of the adhesive on ultrasonic bonding equipment. In one embodiment of the invention, a composite includes an adhesive having a capillary-viscosity value of about 7 Passec or greater and a Shore-OO-Hardness value of about 65 or greater, whereby the relative accretion value is less than about 1, and more particularly less than about 0.5.