The invention is directed to a method for polishing a cutting edge on a cutting
instrument, comprising contacting a cutting edge of a cutting instrument with a
polishing pad and a chemical-mechanical polishing composition comprising particles
of an abrasive, and a liquid carrier, wherein the abrasive is suspended in the
liquid carrier, and abrading at least a portion of the cutting edge to polish the
cutting edge. The invention further provides a cutting instrument having a highly
uniform edge.