The present invention is a polymeric composite comprising a polyimide component and a fluoropolymer component derived from a micro powder. The fluoropolymer micro powder has a melt point between 250 and 375 C. The fluoropolymer micro powder has an average particle size between 20 and 5000 nanometers (5.0 microns). The polyimide component and the fluoropolymer component are inter-mixed at a high dispersion level where the fluoropolymer component is present in a weight ratio from 10 to 60 percent. The polymeric composite of these two components is particularly useful in the form of a thin film used in high-speed digital circuitry or high signal integrity for low loss of a digital signal. The film can also be used as a wire wrap, or as a coverlay or base film substrate for flexible circuitry laminates.