A packaging system for electronic circuitry is provided. The electronic circuitry
may be disposed upon a substrate, which can be encased or otherwise surrounded
by one or more components of the packaging system. The packaging system may include
(i) an inner housing that can encase or otherwise enclose the substrate within
its confines; (ii) an outer housing that in turn encases or encloses the combination
of the inner housing and the substrate within its confines; and (iii) one or more
gaps positioned between the electronic circuitry, inner housing and outer housing.
The gaps may be filled with fluid or solid insulating media. The combination of
the inner housing, outer housing, and gaps can insulate the electronic circuitry
from the detrimental and destructive heating effects when the packaging system
experiences short-term exposure to a high temperature, which thereby allows operability
before, during and after such exposure.