A solid electrolytic capacitor includes a capacitor element assembly, an anode lead and a cathode lead. The assembly includes a plurality of capacitor elements each consisting of a sintered valve metal chip, an anode wire projecting from the chip, a solid electrolytic layer formed on the chip, and a cathode layer formed on the electrolytic layer. The chip of each capacitor element is flat, having a thickness smaller than its length and width. The capacitor elements are stacked in a thickness direction of the chip so that the cathode layers of the respective capacitor elements are connected to each other. The anode wires are fixed to the anode lead. At least one of the cathode layers is directly connected to the cathode lead.

 
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