A modular fluid unit for cooling heat sources located on a rack, the modular
fluid
unit comprising: a heat exchanger in fluid communication a pump; and wherein the
modular fluid unit is mountable within the rack and is configurable to be in fluid
communication with a cold plate return manifold, a cold plate supply manifold,
and an end-user fluid supply. A method for cooling electronic components in a rack,
the method comprising: circulating a first liquid from a cold plate to one of a
plurality of heat exchangers mounted within the rack; circulating a second liquid
from a second liquid supply to the one of a plurality of heat exchangers; and transferring
heat from the first liquid to the second liquid at the one of a plurality of heat exchangers.