In a semiconductor device, a semiconductor module contains a semiconductor element
and having a radiating portion, and a heat absorbing member has a heat absorbing
portion with heat conductivity. A grease member is interposed between the radiating
portion of the semiconductor module and the heat absorbing portion of the heat
absorbing member. The radiating portion and absorbing portion are opposite and
close to each other through the grease member in a predetermined direction. A grease
extrusion path has one end and other end portions and formed in at least one of
the radiating portion and the heat absorbing portion. The one end portion of the
grease extrusion path is configured to contact the grease member, said other end
portion thereof communicates with an exterior of the at least one of the radiating
portion and the heat absorbing portion.