A heat exchanger and method of manufacturing thereof comprises an interface layer
for cooling a heat source. The interface layer is coupled to the heat source and
is configured to pass fluid therethrough. The heat exchanger further comprises
a manifold layer that is coupled to the interface layer. The manifold layer includes
at least one first port that is coupled to a first set of individualized holes
which channel fluid through the first set. The manifold layer includes at least
one second port coupled to a second set of individualized holes which channel fluid
through the second set. The first set of holes and second set of holes are arranged
to provide a minimized fluid path distance between the first and second ports to
adequately cool the heat source. Preferably, each hole in the first set is positioned
a closest optimal distance to an adjacent hole the second set.