A semiconductor package in which solder balls can be loaded on an encapsulated
resin to reduce the package area and a method for producing the semiconductor package.
An apparatus for carrying out the method includes a first insulating substrate
5 carrying a mounting portion 3 for mounting a semiconductor device
2 and a first electrically conductive pattern 4 electrically connected
to the semiconductor device 2, a sidewall section 6 formed upright
around the mounting portion of the first insulating substrate, a cavity 7
defined by the first insulating substrate 5 and the sidewall section and
encapsulated by an encapsulating resin 12 as the semiconductor device 2
is mounted on the mounting portion 3 and a second insulating substrate 10
provided in the cavity 7 and on the sidewall section 6 and carrying
a second electrically conductive pattern 31 electrically connected to the
first electrically conductive pattern 4 via plated through-holes 26
formed in the sidewall section 6. A solder land 9 is provided in
a lattice on one entire surface of the second insulating substrate 10.