The object of the present invention is to provide an engineering plastic cardboard having excellent heat resistance. Said engineering plastic cardboard (1) consists of a core member (2), and covering member(s) (3) covering one or both side(s) of said core member (2), wherein at least said core member (2) is made of an engineering plastic such as polyphenylene ether, or the like, or a polymer alloy of said engineering plastic and thermoplastic resin such as polypropylene, or the like, or a polymer alloy of said engineering plastic, thermoplastic resin, and a rubber-like material.