A heat-peelable pressure-sensitive adhesive sheet which, even when used for temporarily
fixing electronic parts having poor resistance to static electricity, such as magnetic
heads, is effective in preventing the yield of such electronic parts from being
reduced by electrostatic breakage, while ensuring its functions of adhesiveness
before heating and peelability after heating. The heat-peelable pressure-sensitive
adhesive sheet comprises a substrate and formed on at least one side thereof a
heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres,
wherein the heat-expandable pressure-sensitive adhesive layer has a surface resistivity
of 1012 / or lower. In this heat-peelable pressure-sensitive
adhesive sheet, the heat-expandable pressure-sensitive adhesive layer before heating
may have a center line average surface roughness of 2 m or less and a maximum
surface roughness of 5 m or less. The adhesive sheet may have a rubber-like
organic elastic layer interposed between the substrate and the heat-expandable
pressure-sensitive adhesive layer.