A capillary structure for a heat transfer device, such as a heat pipe is provided having a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles. In this way, a network of capillary passageways are formed between the particles to aid in the transfer of working fluid by capillary action, while the plurality of fillets. provide enhanced thermal transfer properties between the plurality of particles so as to greatly improve over all heat transfer efficiency of the device.

 
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< Vapor escape microchannel heat exchanger

< Heat-dissipating device

> Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems

> Heat discharger suitable for application to heat pipes

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