An apparatus and methods for applying a coating to an implantable device. The implantable device can include depots formed in the outer surface thereof to receive the coating. The coating can include a polymer and a solvent applicable to the surface of the implantable device including the depots. The application of the composition is performed under a pressure, which can reduce the surface tension and/or molecular adhesion force of the composition. The reduced surface tension and/or adhesion force allows gas bubbles within the depots to be removed while the composition is being driven into the depots.