The present invention relates to a transfer apparatus for a wafer, in which the wafer may be transferred in a narrow space by reducing a transfer device footprint. The transfer device has a base, a lower arm, an upper arm and a hand. The lower arm is configured to be vertically adjustable and rotatable on a vertical axis. The upper arm is pivotably coupled to the lower arm, and the hand is horizontally coupled to the upper arm.

 
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