Following the deposition of an insulation layer, a patterned P2 pole tip
seed layer is deposited. Significantly, the pole tip seed layer is not deposited
beneath the induction coil area of the magnetic head. A dielectric layer is next
deposited and a patterned RIE etching mask that includes both a P2 pole tip trench
opening and an induction coil trench opening is fabricated upon the dielectric
layer. Thereafter, in a single RIE etching step, the P2 pole tip trench is etched
through the dielectric material down to the seed layer, and the induction coil
trench is etched through the dielectric material down to the insulation layer.
The P2 pole tip is first electroplated up into its trench, an induction coil seed
layer is next deposited, and the induction coil is then electroplated up into the
induction coil trench.