A kit for repairing holes in drywall having two principal components, a patch itself and a moistening device for attaching the patch to the surface upon which the patch is intended to be placed. The patch containing an inner portion configured for insertion within an opening and an outer portion configured to attach and connect with the wall upon which the patch is placed. The moistening device, preferably a form of spray on texture provides a means for adhering the patch to the surface upon which it is placed and also provides a means for covering the patch so as to blend with the surrounding surfaces.