An impedance matching circuit is provided for an IC arranged on a package that matches an impedance of an external load. The circuit includes a package, an IC that is arranged on the package, and an impedance matching circuit. The impedance matching circuit includes a first bondwire arranged on the package that has one end that communicates with the external load and an opposite end that communicates with said IC, a capacitance element arranged on the IC, and a second bondwire arranged on the package that has one end that communicates with the external load and an opposite end that communicates with one end of said capacitance element.