A two sided wafer handling end-effector provides for the efficient loading and unloading of wafers into and out of a wafer processing apparatus. Each side of the end-effector includes spaced apart rotatable catch mechanisms between which a wafer is firmly grasped. When the end-effector is positioned beneath the wafer processing apparatus the catch mechanisms are rotated to an open position and a lifting surface on the catch mechanisms lifts the wafer into the wafer processing apparatus. When the catch mechanisms are in the open position the wafer is centered on the end-effector by rotatable rocker assemblies that contact the edge of the wafer. As the end-effector is raised into contact with the processing apparatus, the rocker assemblies rotate to a lowered position in the end-effector while arcuate surfaces on the assemblies maintain contact with the wafer edge.