A system for providing electrical contacts between a die and an electrical device includes a package having a first major surface, a second major surface, a first scalloped edge, a second scalloped edge, and a solid end adapted for insertion into a slot. The solid end for carries power to the die or input/output signals. The scalloped edges also carry power. The package includes a plurality of electrical pins which carry input/output signals as well as power. The socket of the system includes a base having an opening therein adapted to receive the package. A cover with openings for receiving the pins covers the base. A power contact unit includes a pair of scalloped edges and a slot. The power contact unit and the cover moves with respect to the base of the socket.