An implementing method for buffering devices is provided, so as to dispose the buffering devices on a chip. The chip includes a signal source root and the number X of output bonding pads, in which the number X is a positive integer. The implementing method of the present invention includes (a) implementing a buffering device for the N^th layer at a location close to the middle place between two output bonding pads, and electrically connecting each one of the output bonding pads to the corresponding one of the buffering devices for the N^th layer, respectively. (b) A buffering device for the N+1^th layer is implemented at a location close to the middle place between two buffering devices for the N^th layer, and each one of the buffering devices for the N^th layer is electrically connected to the corresponding one of the buffering devices for the N+1^th layer, respectively. Then, the number of the buffering devices for the N+1^th layer is judged whether or not to be 1. If it is, then the buffering device for the N+1^th layer is connected to the signal source root and the method goes to end. If it is not, the method goes to the step (c). In the step (c), the quantity of the parameter N is added by 1, and then the method repeatedly performs the step (b).